Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7989948 | Chip package structure and method of fabricating the same | Jui-Ching Hsieh, Pin Chang, Chung-De Chen, Li-Chi Pan, Yu-Jen Wang | 2011-08-02 |
| 7960805 | MEMS structure with suspended microstructure that includes dielectric layer sandwiched by plural metal layers and the dielectric layer having an edge surrounded by peripheral metal wall | Jen-Yi Chen | 2011-06-14 |