PC

Phillip F. Chapman

IBM: 2 patents #2,055 of 9,568Top 25%
📍 Colchester, VT: #16 of 55 inventorsTop 30%
🗺 Vermont: #161 of 615 inventorsTop 30%
Overall (2011): #73,900 of 364,097Top 25%
2
Patents 2011

Issued Patents 2011

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
8021941 Bias-controlled deep trench substrate noise isolation integrated circuit device structures David Goren, Rajendran Krishnasamy, Benny Sheinman, Shlomo Shlafman, Raminderpal Singh +1 more 2011-09-20
8017471 Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry David S. Collins, Steven H. Voldman 2011-09-13