Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8081469 | Thermal interface material and method of using the same and electronic assembly having the same | Yuan Yao, Feng-Wei Dai, Ji Wang, Hui Zhang | 2011-12-20 |
YW
You Wang
Tsinghua University: 1 patents #86 of 213Top 45%
Overall (2011): #121,214 of 364,097Top 35%
1
Patents 2011