Feng-Wei Dai

Foxconn: 1 patents #481 of 1,087Top 45%

TU Tsinghua University: 1 patents #86 of 213Top 45%

📍 San Jose, CA: #1,637 of 4,297 inventorsTop 40%

🗺 California: #14,783 of 41,698 inventorsTop 40%

Overall (2011): #305,167 of 364,097Top 85%

Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #	Title	Co-Inventors	Date
8081469	Thermal interface material and method of using the same and electronic assembly having the same	You Wang, Yuan Yao, Ji Wang, Hui Zhang	2011-12-20