Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8020747 | Soldering method and soldering apparatus | Masato Nakamura | 2011-09-20 |
| 8022551 | Solder composition for electronic devices | Tasao Soga, Hanae Shimokawa, Kazuma Miura, Mikio Negishi, Hirokazu Nakajima +1 more | 2011-09-20 |
| 7911062 | Electronic component with varying rigidity leads using Pb-free solder | Koji Serizawa | 2011-03-22 |