Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8022551 | Solder composition for electronic devices | Tasao Soga, Tetsuya Nakatsuka, Kazuma Miura, Mikio Negishi, Hirokazu Nakajima +1 more | 2011-09-20 |
| 8004075 | Semiconductor power module including epoxy resin coating | Tasao Soga, Daisuke Kawase, Kazuhiro Suzuki, Eiichi Morisaki, Katsuaki Saito | 2011-08-23 |