Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7982316 | Semiconductor package having a land to absorb thermal and mechanical stress and fabricating method thereof | Min-Woo Lee, Se Woong Cha | 2011-07-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7982316 | Semiconductor package having a land to absorb thermal and mechanical stress and fabricating method thereof | Min-Woo Lee, Se Woong Cha | 2011-07-19 |