Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8058726 | Semiconductor device having redistribution layer | Jung Gi Jin, Jong Sik Paek, Sung Su Park, Seok KIM, Tae Kyung Hwang | 2011-11-15 |
| 7982316 | Semiconductor package having a land to absorb thermal and mechanical stress and fabricating method thereof | Min-Woo Lee, Jae Hyun SHIN | 2011-07-19 |