Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7968374 | Layered chip package with wiring on the side surfaces | Yoshitaka Sasaki, Hiroyuki Ito, Tatsuya Harada, Nobuyuki Okuzawa, Hiroshi Ikejima | 2011-06-28 |
| 7964976 | Layered chip package and method of manufacturing same | Yoshitaka Sasaki, Hiroyuki Ito, Tatsuya Harada, Nobuyuki Okuzawa, Hiroshi Ikejima | 2011-06-21 |
| 7868442 | Layered chip package and method of manufacturing same | Yoshitaka Sasaki, Hiroyuki Ito, Tatsuya Harada, Nobuyuki Okuzawa | 2011-01-11 |
| 7863095 | Method of manufacturing layered chip package | Yoshitaka Sasaki, Hiroyuki Ito, Tatsuya Harada, Nobuyuki Okuzawa | 2011-01-04 |