Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7968374 | Layered chip package with wiring on the side surfaces | Yoshitaka Sasaki, Hiroyuki Ito, Tatsuya Harada, Nobuyuki Okuzawa, Satoru Sueki | 2011-06-28 |
| 7964976 | Layered chip package and method of manufacturing same | Yoshitaka Sasaki, Hiroyuki Ito, Tatsuya Harada, Nobuyuki Okuzawa, Satoru Sueki | 2011-06-21 |
| 7915083 | Method of manufacturing layered chip package | Yoshitaka Sasaki, Hiroyuki Ito, Atsushi Iijima | 2011-03-29 |
| 7902677 | Composite layered chip package and method of manufacturing same | Yoshitaka Sasaki, Hiroyuki Ito, Atsushi Iijima | 2011-03-08 |