HI

Hiroyuki Ito

HT Headway Technologies: 16 patents #3 of 70Top 5%
S( Sae Magnetics (H.K.): 9 patents #3 of 137Top 3%
Tdk: 5 patents #41 of 474Top 9%
SE Seiko Epson: 4 patents #119 of 1,442Top 9%
HH Hitachi High-Technologies: 3 patents #62 of 523Top 15%
DE Denso: 2 patents #136 of 1,195Top 15%
PA Panasonic: 2 patents #835 of 4,214Top 20%
📍 Kakogawa, CA: #1 of 2 inventorsTop 50%
Overall (2011): #298 of 364,097Top 1%
27
Patents 2011

Issued Patents 2011

Showing 26–27 of 27 patents

Patent #TitleCo-InventorsDate
7868442 Layered chip package and method of manufacturing same Yoshitaka Sasaki, Tatsuya Harada, Nobuyuki Okuzawa, Satoru Sueki 2011-01-11
7863095 Method of manufacturing layered chip package Yoshitaka Sasaki, Tatsuya Harada, Nobuyuki Okuzawa, Satoru Sueki 2011-01-04