Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8048761 | Fabricating method for crack stop structure enhancement of integrated circuit seal ring | Alfred Yeo | 2011-11-01 |
| 8003448 | Semiconductor package and method for producing the same | Charles Wee Ming Lee, Gerald Ofner | 2011-08-23 |
| 7892963 | Integrated circuit packaging system and method of manufacture thereof | Alfred Yeo | 2011-02-22 |