Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8048761 | Fabricating method for crack stop structure enhancement of integrated circuit seal ring | Kai Chong Chan | 2011-11-01 |
| 7892963 | Integrated circuit packaging system and method of manufacture thereof | Kai Chong Chan | 2011-02-22 |