Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7955953 | Method of forming stacked die package | Heng Keong Yip | 2011-06-07 |
| 7886609 | Pressure sensor package | Boon Seong Lee, Kar Yoke Ong | 2011-02-15 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7955953 | Method of forming stacked die package | Heng Keong Yip | 2011-06-07 |
| 7886609 | Pressure sensor package | Boon Seong Lee, Kar Yoke Ong | 2011-02-15 |