HY

Heng Keong Yip

FS Freeescale Semiconductor: 1 patents #222 of 817Top 30%
📍 Shah Alam, MY: #1 of 3 inventorsTop 35%
Overall (2011): #288,134 of 364,097Top 80%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7955953 Method of forming stacked die package Wai Yew Lo 2011-06-07