Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8039386 | Method for forming a through silicon via (TSV) | Ross E. Noble, Dina H. Triyoso | 2011-10-18 |
| 7964502 | Multilayered through via | Chanh M. Vuong | 2011-06-21 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8039386 | Method for forming a through silicon via (TSV) | Ross E. Noble, Dina H. Triyoso | 2011-10-18 |
| 7964502 | Multilayered through via | Chanh M. Vuong | 2011-06-21 |