Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8039386 | Method for forming a through silicon via (TSV) | Thuy B. Dao, Dina H. Triyoso | 2011-10-18 |
| 7972922 | Method of forming a semiconductor layer | Hunter J. Martinez, John J. Hackenberg, Jill C. Hildreth | 2011-07-05 |