Issued Patents 2011
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8030098 | Pre-formed conductive bumps on bonding pads | Albert Wu, Huahung Kao | 2011-10-04 |
| 8022522 | Semiconductor package | Chenglin Liu | 2011-09-20 |
| 7999395 | Pillar structure on bump pad | Huahung Kao | 2011-08-16 |
| 7969022 | Die-to-die wire-bonding | Chenglin Liu | 2011-06-28 |
| 7957094 | Thermal solution for drive systems such as hard disk drives and digital versatile discs | Chenglin Liu | 2011-06-07 |
| 7911053 | Semiconductor packaging with internal wiring bus | Chenglin Liu, Albert Wu | 2011-03-22 |
| 7883947 | Method of fabricating a device with ESD and I/O protection | Chuan-Cheng Cheng, Choy Hing Li | 2011-02-08 |