Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8030098 | Pre-formed conductive bumps on bonding pads | Shiann-Ming Liou, Albert Wu | 2011-10-04 |
| 7999395 | Pillar structure on bump pad | Shiann-Ming Liou | 2011-08-16 |
| 7956474 | Structures, architectures, systems, methods, algorithms and software for configuring an integrated circuit for multiple packaging types | Tyson Leistiko | 2011-06-07 |