Yong Lam Wai

CBCarsem (M) Sdn. Bhd.: 1 patents #1 of 3Top 35%

Overall (2011): #121,223 of 364,097Top 35%

1 Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #	Title	Co-Inventors	Date
8071470	Wafer level package using stud bump coated with solder	Lily Khor, Lau Choong Keong	2011-12-06