Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8071470 | Wafer level package using stud bump coated with solder | Lily Khor, Yong Lam Wai | 2011-12-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8071470 | Wafer level package using stud bump coated with solder | Lily Khor, Yong Lam Wai | 2011-12-06 |