Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8076182 | Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity over the post | Charles W. C. Lin, Chia-Chung Wang | 2011-12-13 |
| 8003416 | Method of making a semiconductor chip assembly with a post/base heat spreader and dual adhesives | Charles W. C. Lin, Chia-Chung Wang | 2011-08-23 |
| 7939375 | Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity in the post | Charles W. C. Lin, Chia-Chung Wang | 2011-05-10 |