Issued Patents 2011
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8076182 | Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity over the post | Chia-Chung Wang, Sangwhoo Lim | 2011-12-13 |
| 8067784 | Semiconductor chip assembly with post/base heat spreader and substrate | Chia-Chung Wang | 2011-11-29 |
| 8067270 | Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate | Chia-Chung Wang | 2011-11-29 |
| 8062912 | Method of making a semiconductor chip assembly with a post/base heat spreader and horizontal signal routing | Chia-Chung Wang | 2011-11-22 |
| 8034645 | Method of making a semiconductor chip assembly with a copper/aluminum post/base heat spreader | Chia-Chung Wang | 2011-10-11 |
| 8003415 | Method of making a semiconductor chip assembly with a post/base heat spreader and vertical signal routing | Chia-Chung Wang | 2011-08-23 |
| 8003416 | Method of making a semiconductor chip assembly with a post/base heat spreader and dual adhesives | Chia-Chung Wang, Sangwhoo Lim | 2011-08-23 |
| 7993983 | Method of making a semiconductor chip assembly with chip and encapsulant grinding | — | 2011-08-09 |
| 7951622 | Method of making a semiconductor chip assembly with a post/base heat spreader and a signal post | Chia-Chung Wang | 2011-05-31 |
| 7948076 | Semiconductor chip assembly with post/base heat spreader and vertical signal routing | Chia-Chung Wang | 2011-05-24 |
| 7939375 | Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity in the post | Chia-Chung Wang, Sangwhoo Lim | 2011-05-10 |
| 7932165 | Method of making a semiconductor chip assembly with a laterally aligned filler and insulative base | Cheng-Chung Chen | 2011-04-26 |
| 7901993 | Method of making a semiconductor chip assembly with an aluminum post/base heat spreader and a silver/copper conductive trace | Chia-Chung Wang | 2011-03-08 |