Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8011917 | Compression molding of an electronic device | Ji Hao, Jian Xiong SU, Teng Hock Kuah, Ee Ling Chiw | 2011-09-06 |
| 7927087 | Method and apparatus for molding with reduced cull formation | Xiang Chen, Shu Chuen Ho, Teng Hock Kuah, Si Liang Lu | 2011-04-19 |