Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8011917 | Compression molding of an electronic device | See Yap Ong, Jian Xiong SU, Teng Hock Kuah, Ee Ling Chiw | 2011-09-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8011917 | Compression molding of an electronic device | See Yap Ong, Jian Xiong SU, Teng Hock Kuah, Ee Ling Chiw | 2011-09-06 |