Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8043956 | Wire bonding on reactive metal surfaces of a metallization of a semiconductor device by providing a protective layer | Matthias Lehr | 2011-10-25 |
| 8039958 | Semiconductor device including a reduced stress configuration for metal pillars | Alexander Platz, Matthias Lehr | 2011-10-18 |
| 7993936 | System and method for controlling an electrochemical etch process | Kerstin Siury, Niels Rackwitz, Joern Schnapke | 2011-08-09 |
| 7897433 | Semiconductor chip with reinforcement layer and method of making the same | Michael Z. Su, Jaime Bravo | 2011-03-01 |