Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7919409 | Materials for adhesion enhancement of copper film on diffusion barriers | Hansong Cheng, Xinjian Lei, Daniel P. Spence, John Anthony Thomas Norman, Bo Han +2 more | 2011-04-05 |