Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7982307 | Integrated circuit chip assembly having array of thermally conductive features arranged in aperture of circuit substrate | Ahmed Amin, David Crouthamel, John W. Osenbach, Brian T. Vaccaro | 2011-07-19 |
| 7923347 | Controlling warping in integrated circuit devices | John W. Osenbach, Weidong Xie | 2011-04-12 |