Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7982307 | Integrated circuit chip assembly having array of thermally conductive features arranged in aperture of circuit substrate | Ahmed Amin, John W. Osenbach, Thomas H. Shilling, Brian T. Vaccaro | 2011-07-19 |