Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7973544 | Thermal monitoring and management of integrated circuits | Vance D. Archer, III, Daniel Chesire, Warren K. Gladden, Taeho Kook, Sailesh Mansinh Merchant +1 more | 2011-07-05 |
| 7952206 | Solder bump structure for flip chip semiconductor devices and method of manufacture therefore | Mark A. Bachman, Donald S. Bitting, Sailesh Chittipeddi, Sailesh Mansinh Merchant | 2011-05-31 |