Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7952206 | Solder bump structure for flip chip semiconductor devices and method of manufacture therefore | Mark A. Bachman, Sailesh Chittipeddi, Seung H. Kang, Sailesh Mansinh Merchant | 2011-05-31 |