Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8076765 | Stackable semiconductor device packages including openings partially exposing connecting elements, conductive bumps, or conductive conductors | Chi-Chih Shen, Jen-Chuan Chen, Wen-Hsiung Chang, Hui-Shan Chang, Pei-Yu Hsu +5 more | 2011-12-13 |
| 8058725 | Package structure and package substrate thereof | Chen-Ming Cheng, Hung-Ju Chung | 2011-11-15 |
| 7927924 | Semi-finished package and method for making a package | Ren-Yi Cheng, Chun-Hung Hsu | 2011-04-19 |