Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8076765 | Stackable semiconductor device packages including openings partially exposing connecting elements, conductive bumps, or conductive conductors | Kuang-Hsiung Chen, Chi-Chih Shen, Wen-Hsiung Chang, Hui-Shan Chang, Pei-Yu Hsu +5 more | 2011-12-13 |
| 8012797 | Method for forming stackable semiconductor device packages including openings with conductive bumps of specified geometries | Chi-Chih Shen, Wen-Hsiung Chang, Chi-Chih Chu, Cheng-Yi Weng | 2011-09-06 |