Issued Patents 2005
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6972964 | Module board having embedded chips and components and method of forming the same | Kwun-Yao Ho | 2005-12-06 |
| 6960826 | Multi-chip package and manufacturing method thereof | Kwun-Yao Ho | 2005-11-01 |
| 6951773 | Chip packaging structure and manufacturing process thereof | Kwun-Yo Ho | 2005-10-04 |
| 6946727 | Vertical routing structure | Kwun-Yao Ho | 2005-09-20 |
| 6929488 | Electrical connection device between a pin-typed IC package and a circuit board | Kwun-Yao Ho | 2005-08-16 |
| 6916687 | Bump process for flip chip package | Kwun-Yao Ho | 2005-07-12 |
| 6913814 | Lamination process and structure of high layout density substrate | Kwun-Yao Ho | 2005-07-05 |
| 6902997 | Process of forming bonding columns | Kwun-Yao Ho | 2005-06-07 |
| 6896173 | Method of fabricating circuit substrate | Kwun-Yao Ho | 2005-05-24 |
| 6894904 | Tab package | Kwun-Yao Ho | 2005-05-17 |
| 6881662 | Pattern formation process for an integrated circuit substrate | Kwun-Yao Ho | 2005-04-19 |
| 6876087 | Chip scale package with heat dissipating part | Kwun-Yao Ho | 2005-04-05 |
| 6865089 | Module board having embedded chips and components and method of forming the same | Kwun-Yao Ho | 2005-03-08 |
| 6849534 | Process of forming bonding columns | Kwun-Yao Ho | 2005-02-01 |
| 6849955 | High density integrated circuit packages and method for the same | Kwun-Yao Ho | 2005-02-01 |