JT

Jen-Te Tseng

VT Via Technologies: 2 patents #24 of 142Top 20%
Overall (2005): #50,806 of 245,428Top 25%
2
Patents 2005

Issued Patents 2005

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6946601 Electronic package with passive components I-Tseng Lee 2005-09-20
6919628 Stack chip package structure I-Tseng Lee, Hsueh-Kuo Liao 2005-07-19