Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6946738 | Semiconductor packaging substrate and method of producing the same | Wen-Yuan Chang | 2005-09-20 |
| 6882057 | Quad flat no-lead chip carrier | — | 2005-04-19 |
| 6861740 | Flip-chip die and flip-chip package substrate | — | 2005-03-01 |