TH

Tsing-Fong Hwang

UM United Microelectronics: 3 patents #8 of 278Top 3%
📍 Tainan, TW: #17 of 262 inventorsTop 7%
Overall (2005): #15,266 of 245,428Top 7%
3
Patents 2005

Issued Patents 2005

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
6940146 Interconnect structure with an enlarged air gaps disposed between conductive structures or surrounding a conductive structure within the same Ellis Lee 2005-09-06
6914318 Interconnect structure with an enlarged air gaps disposed between conductive structures or surrounding a conductive structure within the same Ellis Lee 2005-07-05
6888247 Interconnect structure with an enlarged air gaps disposed between conductive structures or surrounding a conductive structure within the same Ellis Lee 2005-05-03