YI

Yukihiro Isa

UJ Umc Japan: 2 patents #1 of 2Top 50%
📍 Tateyama, JP: #1 of 4 inventorsTop 25%
Overall (2005): #27,662 of 245,428Top 15%
2
Patents 2005

Issued Patents 2005

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6959485 Bump ball crimping apparatus 2005-11-01
6911387 Bump forming method and apparatus for heating and compressing bump materials inserted in positioning holes 2005-06-28