Issued Patents 2005
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6958285 | Methods of manufacturing devices having substrates with opening passing through the substrates and conductors in the openings | — | 2005-10-25 |
| 6897148 | Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby | Patrick Halahan, Sam Kao, Bosco Lan, Sergey Savastiouk | 2005-05-24 |
| 6882030 | Integrated circuit structures with a conductor formed in a through hole in a semiconductor substrate and protruding from a surface of the substrate | — | 2005-04-19 |
| 6844241 | Fabrication of semiconductor structures having multiple conductive layers in an opening | Patrick B. Halahan | 2005-01-18 |