Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6977188 | Resin encapsulation molding method of electronic part and resin encapsulation molding apparatus used therefor | — | 2005-12-20 |
| 6929977 | Method of introducing resin for electronic component and apparatus used therefor | Takashi Tamura, Yohei Onishi | 2005-08-16 |