MO

Michio Osada

TO Towa: 1 patents #2 of 6Top 35%
Overall (2005): #135,611 of 245,428Top 60%
1
Patents 2005

Issued Patents 2005

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6919223 Method of manufacturing semiconductor resin molding and resin member employed therefor 2005-07-19