Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6919639 | Multiple copper vias for integrated circuit metallization and methods of fabricating same | Paul S. Ho, Ennis T. Ogawa, Hideki Matsuhashi | 2005-07-19 |
KL
Ki-Don Lee
Overall (2005): #157,518 of 245,428Top 65%
1
Patents 2005