Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6844626 | Bond pad scheme for Cu process | Chia-Hung Lai, Tzong-Sheng Chang, Min Cao, Huan Chi Tseng, Yu-Hua Lee +1 more | 2005-01-18 |
JL
Jiunn-Jyi Lin
Overall (2005): #174,971 of 245,428Top 75%
1
Patents 2005