Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6849546 | Method for improving interlevel dielectric gap filling over semiconductor structures having high aspect ratios | Chen-Ming Huang | 2005-02-01 |
AT
An-Chun Tu
Overall (2005): #235,911 of 245,428Top 100%
1
Patents 2005