Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6901343 | MULTILAYER BOARD IN WHICH WIRING OF SIGNAL LINE THAT REQUIRES TAMPER-RESISTANCE IS COVERED BY COMPONENT OR FOIL, DESIGN APPARATUS, METHOD, AND PROGRAM FOR THE MULTILAYER BOARD, AND MEDIUM RECORDING THE PROGRAM | Eiji Takahashi, Yoshiyuki Saito, Osamu Shibata, Shinichi Tanimoto, Takeshi Nakayama | 2005-05-31 |