Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6909168 | Resin encapsulation semiconductor device utilizing grooved leads and die pad | Masanori Minamio | 2005-06-21 |
TN
Toru Nomura
Overall (2005): #84,336 of 245,428Top 35%
1
Patents 2005