Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6881611 | Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device | Norio Fukasawa, Toshimi Kawahara, Muneharu Morioka, Mitsunada Osawa, Yasuhiro Shinma +6 more | 2005-04-19 |
| 6856017 | Device having resin package and method of producing the same | Yoshiyuki Yoneda, Kazuto Tsuji, Seiichi Orimo, Hideharu Sakoda, Ryuji Nomoto +1 more | 2005-02-15 |