Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6919226 | Method for producing a multi-chip circuit module including a multi-layered wiring section utilizing a via-on-via structure | Yuji Nishitani | 2005-07-19 |
| 6885099 | Multichip module, manufacturing method thereof, multichip unit and manufacturing method thereof | — | 2005-04-26 |