Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6977035 | Method for electrolytic copper plating | Masaru Kusaka, Shinjiro Hayashi | 2005-12-20 |
| 6899781 | Method for forming resin composite material | Masaru Seita, Masaaki Imanari, Koichi Yomogida, Hidemi Nawafune | 2005-05-31 |
| 6881319 | Electrolytic copper plating solution and method for controlling the same | Masaru Seita, Shinjiro Hayashi | 2005-04-19 |