Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6921977 | Semiconductor package, method of production of same, and semiconductor device | Akio Rokugawa, Takahiro Iijima | 2005-07-26 |
| 6900542 | Semiconductor device having increased adhesion between a barrier layer for preventing copper diffusion and a conductive layer, and method of manufacturing the same | Hisaya Sakai, Nobuyuki Ohtsuka | 2005-05-31 |
| 6884655 | Semiconductor package, method of manufacturing the same, and semiconductor device | Takahiro Iljima, Akio Rokugawa | 2005-04-26 |